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| Substrate Material |
| 96% Alumina |
T-Clad |
| 99% Alumina |
Flexi |
| Aluminium Nitride |
Flexi-Rigid |
| Steel |
FR4 |
Different sizes, thicknesses, surface flatnesses, unusual shapes and holes can all be achieved to satisfy design criteria.
| Conductors |
| Wire Bondable |
Gold 4-7mΩ/square |
| Solderable |
Palladium-Silver 20-30mΩ/square |
| Solderable On Gold |
Platinum-Gold 50-60mΩ/square |
| Standard Track and Gap |
0.127mm |
| Minimum Track and Gap |
0.05mm (clean edges) |
| Conductor Layers |
5 each side |
| Printed through Holes |
in Gold or Palladium-Silver |
| Resistors |
| Range OR1 to 15 Gohms |
| Tolerance absolute |
± 0.05% |
| Matched |
± 0.1% |
| Absolute TCR |
± 100 ppm/°C Standard |
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± 50 ppm/°C Readily available |
| Tracking |
10 ppm/°C Standard |
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2 ppm/°C Available |
| 1000Hr Load Stability |
0.2% Typical |
| Power Dissipation |
0.04W/mm2 @ 125°C |
| Voltage Handling |
Up to 40KV by design |
| Functional Trimming |
Active trim of circuit performance on R's or C's |
| Wire Bonding |
| Gold Thermosonic |
Ideal for MCM-C |
| Aluminium Ultrasonic |
Ideal for MCM-L and COB |
| Add on Components |
| Bare Die |
Diodes, transistors, FETs, digital and analogue ICs, memory and microprocessors, thin film resistors and capacitors |
| Surface Mount |
Most available packages including µBGAs, and 0201s in volume |
Formats
dil/sil/sm/quad/custom BGA/multi layer and mixed technology and custom optical displays
PCB panels up to 610 x 380mm
Testing
Full functional test as mutually agreed
Screening
Heat Soak
Burn In
Temperature Cycling
Environmental Protection
Various coatings, pottings and sealed housings are available
RoHS Compliance
Design and manufacture is fully RoHS compliant. Leaded capability fully retained for client choice
The above should be considered as a guide only. Not all of the performance limits are available
for all of the endless application possibilities.
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