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CorinTech has a broad range of design and manufacturing capabilities to permit
it to integrate the optimum solution into its clients’ products. These currently include:
- Surface Mount Assemblies
- Thick Film Hybrids
- Chip and Wire, Chip on Board - COB
- Multichip Modules MCM-L&C
- Flexis / Flexi Rigid PCB’s
- Opto Electronics
- High Temperature Circuits
- High Power Circuits
- Circuits on TClad, Steel
- Micropackaging
- Chip Scale Packaging - CSP
Manufacturing equipment supports the volume assembly of components including bare die, 0201,
uBGAs and a wide range of optoelectronics.
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